CLEO 2018 Post Deadline Paper: SPOC collaboration

Sunday 13 May 18
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Large-scale Integration of Multidimensional Quantum Photonics Circuits on Silicon

Technologies relying on quantum mechanics are steadily becoming a bigger and bigger part of our daily lives. While more common quantum hardware approaches rely on entangling binary (i.e. only 2 states) particles, high-dimensional quantum technology, where the particle may be prepared in several states, holds the promise for increased quantum information efficiency, noise resilience, communication speed, etc., paving the way for many ground breaking real-life applications. We report the first large-scale silicon-photonics quantum circuit, integrating more than 500 photonic components, able to generate, manipulate and measure multidimensional entanglement fully on-chip with unprecedented precision, controllability and universality.

https://doi.org/10.1364/CLEO_AT.2018.JTh5B.4

https://spoc.dtu.dk/nyheder/2018/05/spoc-collaboration-results-in-post-deadline-paper-at-cleo-2018
14 MAY 2024